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X-WR-CALDESC:Events for Ardent Concepts
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DTSTART;TZID=America/New_York:20240606T110000
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UID:10000175-1717671600-1717673400@staging.ardentconcepts.com
SUMMARY:Introduction to TR Multicoax Series Webinar
DESCRIPTION:Join us for a free 30 minute introduction to our TR Multicoax Series where you will learn the key features and benefits of the highest density\, high speed\, multicoax connector on the market! \nKey Takeaways from this Webinar: \n\nLearn about the benefits of high speed high density connectors that come in a variety of form factors.\nSolderless compression mount technology allows these connectors to be reused across multiple programs and boards promoting exponential cost savings.\nSuperior signal integrity offered through 20 GHz\, 40 GHz\, and 70 GHz configurations to suit your bandwidth requirements.
URL:https://staging.ardentconcepts.com/event/introduction-to-tr-multicoax-series-webinar-2/2024-06-06/
LOCATION:Webinar
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UID:10000371-1717678800-1717680600@staging.ardentconcepts.com
SUMMARY:Transition to Solderless Interposers: Enhancing Quantum Processor Connections with Amphenol Ardent Concepts’ CA™ and SK™ Series
DESCRIPTION:We invite you to attend our webinar: “Transition to Solderless Interposers: Enhancing Quantum Processor Connections with Amphenol Ardent Concepts’ CA™ and SK™ Series Connectors.” Discover how the latest advancements in interposer technology are revolutionizing quantum computing. We will discuss the benefits provided by true solderless connectivity\, eliminating wire bonds and indium bumps\, and enabling high-density pin configurations. Driven by our ongoing commitment to exceptional signal integrity\, Amphenol Ardent Concepts offers cutting-edge materials and design optimizations that support functional compatibility with cryogenic conditions. Explore the potential for customized solutions tailored to meet the specific needs of your quantum computing application. \nKey Takeaways: \n\nSolderless Connectivity & Component Conservation: Simplifies assembly and enables the reuse of components\, reducing costs and waste.\nMaterial Advancements: Utilizes advanced\, low-outgassing\, and cryogenically suitable materials to enhance performance and reliability.\nOptimized Contact Properties & Customization: Our low-resistance contacts deliver excellent signal integrity across a range of applications and we offer flexible design solutions tailored to suit your needs. Custom plating options are available for environments sensitive to magnetism.
URL:https://staging.ardentconcepts.com/event/transition-to-solderless-interposers-enhancing-quantum-processor-connections-with-amphenol-ardent-concepts-ca-and-sk-series/
LOCATION:Webinar
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